Thermal packaging tools. Vol. 4, Thermally-informed design of microelectronic components /
Uloženo v:
| Další autoři: | |
|---|---|
| Médium: | Kniha |
| Jazyk: | angličtina |
| Vydáno: |
Singapore :
World Scientific,
2015
|
| Edice: | Encyclopedia of thermal packaging: a guide to cooling of electronic equipment (World Scientific)
|
| Žánr/forma: | monografie |
| ISBN: | 978-981-4583-43-5 (vol. 4) 978-981-4327-60-2 (set 2) |
| Témata: | |
| Tagy: |
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| 050 | 4 | |a TK7870.25 |b .T44 2015 | |
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| 246 | 3 | 0 | |a Thermally-informed design of microelectronic components |
| 260 | |a Singapore : |b World Scientific, |c c2015 | ||
| 300 | |a xiv, 192 s. : |b il., grafická znázornění | ||
| 490 | 1 | |a Encyclopedia of thermal packaging: a guide to cooling of electronic equipment ; |v Set 2, v. 4 | |
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