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Designing TSVs for 3D integrated circuits

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Bibliographic Details
Main Author: Khan, Nauman (Author) 
Other Authors: Hassoun, Soha (Author) 
Format: Book
Language:English
Published: New York : Springer, 2013
Series:Springer briefs in electrical and computer engineering
Genre/form:monografie
ISBN:978-1-4614-5507-3
Subjects:
3d
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Cover Image
Status Sublibrary Description Location LCC Call number Old Call number
Regular loan NTK collection 3rd floor, shelf 3A/006 TK7874 .893 .K43 2013 A 49174